JP2510162Y2 - 半導体レ―ザ装置 - Google Patents
半導体レ―ザ装置Info
- Publication number
- JP2510162Y2 JP2510162Y2 JP4421490U JP4421490U JP2510162Y2 JP 2510162 Y2 JP2510162 Y2 JP 2510162Y2 JP 4421490 U JP4421490 U JP 4421490U JP 4421490 U JP4421490 U JP 4421490U JP 2510162 Y2 JP2510162 Y2 JP 2510162Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor laser
- laser device
- ground
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims description 85
- 239000011810 insulating material Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 238000005452 bending Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4421490U JP2510162Y2 (ja) | 1990-04-25 | 1990-04-25 | 半導体レ―ザ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4421490U JP2510162Y2 (ja) | 1990-04-25 | 1990-04-25 | 半導体レ―ザ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH044772U JPH044772U (en]) | 1992-01-16 |
| JP2510162Y2 true JP2510162Y2 (ja) | 1996-09-11 |
Family
ID=31557313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4421490U Expired - Fee Related JP2510162Y2 (ja) | 1990-04-25 | 1990-04-25 | 半導体レ―ザ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2510162Y2 (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5271550B2 (ja) * | 2008-01-18 | 2013-08-21 | ローム株式会社 | 半導体レーザ装置およびその製造方法 |
| JP5465508B2 (ja) * | 2009-10-20 | 2014-04-09 | 新光電気工業株式会社 | 半導体レーザ用パッケージ、半導体レーザ装置及び製造方法 |
-
1990
- 1990-04-25 JP JP4421490U patent/JP2510162Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH044772U (en]) | 1992-01-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |